半導體 (Semiconductor)
Multi-Color Patterning
Minimizes Edge Placement Error
Multi-color patterning is a materials-based approach that minimizes EPE, which is the undesirable movement of an edge in any direction,
resulting in shorts, opens and reduced reliability. Contributors are lithography overlay misalignment and process variation processes at the 10nm node and beyond.
- 檔案名稱
- 7nm-aligned_full.png
- 大小
- 6 MB
- 格式
- image/png
- 檔案名稱
- 7nm-misaligned_full.png
- 大小
- 6 MB
- 格式
- image/png
- 檔案名稱
- 7nm-multicolor_full.png
- 大小
- 6 MB
- 格式
- image/png
- 檔案名稱
- 7nm-multi_misaligned_full.png
- 大小
- 6 MB
- 格式
- image/png
Related Content
Pitchwalking
Pitchwalking refers to pitch variation between features; it can degrade performance, power efficiency, or signal integrity. It is caused by inconsistency in feature critical dimension from process variation and mitigated by optimizing deposition and etch for spacer and mandrel uniformity.