Semiconductor R&D Leaders Share Vision for Accelerating Advanced Packaging

February 26, 2025

One of the primary hurdles to unlocking next-generation AI is the energy-efficient performance of chips. Advanced packaging technologies such as 2.5D and 3D integration are at the forefront of this effort. However, the path from innovation to commercialization is highly complex, and it requires a tremendous expansion in workforce. Industry-wide collaboration has never been more crucial.