Advanced Packaging Enters a New Dimension

by Applied Blog | December 20, 2024

Applied Materials recently hosted a panel during IEDM in San Francisco titled, “The Future of Advanced Packaging: 3D is Here, Now What?” In a lively discussion, technology leaders from AMD, Intel, Cadence and Applied offered their perspectives on a wide range of topics – from the key technology building blocks that will enable next-generation AI chips, to how the ecosystem can work together to accelerate the pace of innovation.