Expert Panel To Explore Advances in eBeam Technology

by Applied Blog | February 19, 2025

What’s New: Alongside the 2025 SPIE Advanced Lithography + Patterning conference in San Jose, CA, Applied Materials will bring together a panel of experts from across the semiconductor ecosystem to explore how chipmakers are increasingly using electron beam (eBeam) technology to continue pushing chip scaling to its limits. The discussion – featuring experts from IBM, imec, Intel and Samsung – will highlight emerging challenges in the “angstrom era” of chipmaking.