The Applied Mirra CMP family of products delivers production-proven, high-performance 150mm and 200mm planarization for a wide variety of materials. The systems’ high-speed planarizing platens and multi-zone polishing heads enable superior uniformity and efficiency.

The Applied Mirra system for silicon, STI oxide, polysilicon, and tungsten applications integrates the post-CMP Mesa cleaner that effectively removes slurry, preventing residue formation and minimizing particles and water marks.

To facilitate such challenging applications as copper damascene, WLP, and MEMS, the Applied Mirra system is equipped with the Desica^® cleaner with Marangoni^™ vapor drying for fast, effective, watermark-free drying.