Applied^™ Picosun^­™ Morpher^™ P

Applied^™ Picosun^™ Morpher^™ P

Applied^™ Picosun^™ Morpher^™ P system single wafer ALD system is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables an enhanced process window for demanding production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility.

Applied^™ Picosun^™ Morpher^™ P offers fully automated handling of wafers and an industry standard single wafer vacuum cluster platform. It can be combined with Applied^™ Picosun^™ Morpher^™ F, batch wafer process module, or the Applied^™ Picosun^™ Morpher^™ T, thermal ALD single wafer process module. A state of the art, plasma source enables a wide process library without any damage to highly sensitive substrates and/or sub-layers, and the SEMI S2/S8 certification ensures that the system is compatible with the strictest standards of the industry.

The compact, ergonomic design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. And as a one of its kind, Applied^™ Picosun^™ Morpher^™ P can be connected to an integrated single VCE and robot to make an extremely low footprint, fully automatic tool.