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Multiphysics
ACE+ Suite offers advanced Multiphysics simulation capabilities for a wide range of engineering applications by accurately solving coupled phenomena of fluid flow, heat transfer, chemical reactions, electromagnetics, plasma and structural mechanics.
Apart from the semiconductor manufacturing space, ACE+ suite multiphysics capabilities are used in the design and optimization of fuel cells, EV batteries, HVAC systems, MEMS, heat exchangers, space launch systems, biochips, automotive under-hood and electronics cooling.
ACE+ offers the following Multiphysics capabilities:
Plasma-assisted surface treatments
Thin film deposition using CVD, ALD, PVD and epitaxy
Multiphase flow and heat transfer in porous media and chemical reactors
Multiphase flows using VOF, Two Fluid, Spray or Cavitation modules
Thermal modeling—heating and cooling of reactor systems
Fluid-structure interactions
Electromagnetic heating and characterization
Metal electroplating and electrochemical machining