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半導体
市場と変化
ソリューションとソフトウェア
CMOS based Image Sensors (CIS) are extensively used as cameras today in a variety of end-markets such as smart phones, automobiles, security, augmented reality/virtual reality (AR/VR), industrial vision, and medical systems. CMOS Image Sensors convert incoming light energy or photons to an electrical signal in a device called a photodiode. Each smartphone has between two to six cameras while automobiles have several external and some internal in-cabin vision systems.
Event-based sensing captures signals only when there is a change in the field of view. The combination of image capture, image analysis and machine learning drives applications from photography imaging to information imaging and paves the way for AI- based smart cameras.
Smartphone and camera manufacturers focus on improving the resolution, sensitivity, and speed of image sensors. These aspects can be enabled by pixel size/pitch scaling, new device architectures like stacking-pixel or 3D-pixel, or new photodiode material(s). In addition to pixel scaling, other important attributes are high dynamic range, which refers to the ability of the camera or sensor to work in high and low light conditions and dark current, which represents the noise level in the device.
Applied Materials enables these requirements with our extensive product portfolio in etch, epitaxy, treatment, metals deposition, chemical mechanical planarization (CMP) and implant. By offering a comprehensive portfolio of equipment and IMS™ (Integrated Materials Solution®), Applied Materials also enables the development and manufacturing of the next generation of CIS devices.
More information on this topic can be found on our Master Class and blogs.