EPIC Center
Silicon Valley

On May 22, 2023, Applied Materials announced a landmark investment to build the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment R&D at an Applied campus in Silicon Valley.

The Equipment and Process Innovation and Commercialization (EPIC) Center is planned as the heart of a high-velocity innovation platform designed to accelerate development and commercialization of the foundational technologies needed by the global semiconductor and computing industries.

The multibillion-dollar facility is designed to provide a breadth and scale of capabilities that is unique in the industry, including more than 180,000 square feet – more than three American football fields – of state-of-the-art cleanroom for collaborative innovation with chipmakers, universities and ecosystem partners. Designed from the ground up to accelerate the pace of introducing new manufacturing innovations, the new EPIC Center is expected to reduce the time it takes the industry to bring a technology from concept to commercialization by several years, while simultaneously increasing the commercial success rate of new innovations and the return on R&D investments for the entire semiconductor ecosystem.

During the May 2023 EPIC center announcement, leaders from semiconductor and computing companies, along with major universities, shared their thoughts about the importance of this facility and how semiconductor chips are more critical to the global economy than ever before.

Semiconductor and Computing Companies

AMD  Video Message

AMD
Lisa Su
Chair and Chief Executive Officer

IBM Video Message

IBM
Mukesh Khare
Vice President, Hybrid Cloud
 

Intel Video Message

Intel
Sanjay Natarajan
Senior Vice President and Co-General Manager, Logic Technology Development

Micron Video Message

Micron
Naga Chandrasekaran
Senior Vice President,
Technology Development

NVIDIA Video Message

NVIDIA
Jensen Huang
Co-founder,
President and Chief Executive Officer

Samsung Video Message

Samsung
Jaihyuk Song
Corporate President and CTO of Samsung Electronics’ Device Solutions Business

TSMC Video Message

TSMC
Wei-Jen Lo
Senior Vice President,
Research and Development

Western Digital Video Message

Western Digital
Siva Sivaram
President
 

Universities

ASU Video Message

ASU
Michael Crow
President

MIT Video Message

MIT
Rafael Reif
17th President

SUNY Video Message

SUNY
F. Shadi Shahedipour-Sandvik
Provost-in-Charge

UC Berkeley Video Message

UC Berkeley
Tsu-Jae King Liu
Dean, College of Engineering

UT Austin Video Message

UT Austin
Jay Hartzell
President