Mainstream and

Emerging Technologies

 

 

Mainstream Technologies

 

3D NAND

Material innovations and stack engineering enabling cell scaling and performance improvements
 

Technical Brochure

DRAM → 3D DRAM

Material stack engineering for DRAM and 3D DRAM cell scaling and optimization

Technical Brochure

FinFET → GAA

HKMG stack engineering and metrology supporting FinFET to 3D GAA/nanosheet transition

Technical Brochure

 

 

Emerging Technologies

 

Phase Change Memory

Captures full physics of chalcogenide materials to enable Phase Change Memory (PCM) scaling
 

 

Technical Brochure

Ovonic Threshold

Full physical/defect-centric model to enable Ovonic Threshold Switching (OTS) selector optimization for advanced memories

Technical Brochure

Resistive RAM

Reproduce ion/vacancy diffusion, chemical reactions, statistics for AI applications


 

Technical Brochure

Ferroelectric

Materials and atomic defect focus to unlock ferroelectric device (FeFET, FRAM) performance and reliability

 

Technical Brochure

 

Solve your materials and stack engineering challenges