A new feature article in IEEE Spectrum magazine examines the technology breakthroughs behind Applied Materials’ new SEMVision™ H20 defect review system.

Why It Matters: In the angstrom era of chipmaking, even the smallest defect can compromise chip performance and the yield of the manufacturing process. Distinguishing true defects from false alarms, or “nuisance defects,” has become increasingly difficult. Traditional defect review systems are struggling to keep pace with the demands of modern chip manufacturing. The industry is at an inflection point, where the ability to detect, classify, and analyze defects quickly and accurately is no longer just a competitive advantage – it’s a necessity.

Behind the Breakthrough: In response to these challenges, Applied developed the SEMVision H20 system, a faster and more accurate defect review system that can analyze exponentially more samples without sacrificing sensitivity or resolution. A critical enabler of this innovation is cold field emission (CFE) technology, a breakthrough that has redefined the capabilities of electron beam (eBeam) systems. Operating at room temperature, CFE produces a narrower, more stable beam with a higher density of electrons that results in significantly improved resolution and imaging speed compared to traditional thermal field emission (TFE) technology. For decades, CFE systems were limited to lab usage because it was not possible to keep the tools up and running for adequate periods of time. After more than 10 years of research, Applied engineers solved the reliability issues and in 2022 introduced the industry’s first eBeam systems based on CFE technology.