Semiconductor R&D Leaders Share Vision for Accelerating Advanced Packaging

by Terry Lee | February 26, 2025

One of the primary hurdles to unlocking next-generation AI is the energy-efficient performance of chips. Advanced packaging technologies such as 2.5D and 3D integration are at the forefront of this effort. To address the challenges and opportunities of advanced packaging, Applied Materials hosted the inaugural Leadership Summit for Advanced Packaging as part of our EPIC Advanced Packaging announcement in Singapore.