The Applied UVision 3 system is a DUV Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45nm FEOL and immersion lithography and beyond.

A major departure from traditional lamp-based products, the UVision 3 inspection system utilizes innovative DUV laser 3D Brightfield inspection technology. Combining multi-beam DUV laser illumination, full laser polarization control, simultaneous Brightfield and 3D imaging, and highly-sensitive photo-multiplier tube (PMT) detection, UVision 3 finds more killer defects faster than ever before.

Built on the innovative architecture of the UVision SP, and used by the majority of the top manufacturers for advanced applications, the UVision 3 system triples the number of laser beams scanning the wafer to allow production-worthy throughput at the same sensitivity proven in 45nm and 32nm development. UVision 3’s multi-beam DUV laser architecture allows extendibility beyond the resolution limits of classical optical inspection and is production worthy even for the smallest pixel size.

New features in UVision 3 include: imaging modes in the illumination and collection path which address the contrast versatility required for periphery areas; innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on edge of array and on high-end devices; dual screen configuration with High Resolution Review, which minimizes SEM review time; and new automatic classification capabilities provide quick access to defect-of-interest to reduce yield learning cycle. Additionally, UVision 3’s proprietary ActiveScan technique dynamically compensates for process and color variations within and across wafers.

UVision is part of Applied Materials’ Resolution strategy to lead the metrology and inspection market with continuous advances in absolute resolution, root cause, process response and cost per resolution.